流程简介：开料－－钻孔－－干膜制程－－压合－－减铜－－电镀－－塞孔－－防焊(绿漆/绿油)
－－镀金－－喷锡－－成型－－开短路测试－－终检－－雷射钻孔
a.开料(cutlamination)
a-1裁板(sheetscutting)
a-2原物料发料(panel)(shearmaterialtosize)
b.钻孔(drilling)
b-1内钻(innerlayerdrilling)
b-2一次孔(outerlayerdrilling)
b-3二次孔(2nddrilling)
b-4雷射钻孔(laserdrilling)(laserablation)
b-5盲(埋)孔钻孔(blind&buriedholedrilling)
c.干膜制程(photoprocess(d/f))
c-1前处理(pretreatment)
c-2压膜(dryfilmlamination)
c-3曝光(exposure)
c-4显影(developing)
c-5蚀铜(etching)
c-6去膜(stripping)
c-7初检(touch-up)
c-8化学前处理,化学研磨(chemicalmilling)
c-9选择性浸金压膜(selectivegolddryfilmlamination)
c-10显影(developing)
c-11去膜(stripping)
developing,etching&stripping(des)
d.压合lamination
d-1黑化(blackoxidetreatment)
d-2微蚀(microetching)
d-3铆钉组合(eyelet)
d-4叠板(layup)
d-5压合(lamination)
d-6后处理(posttreatment)
d-7黑氧化(blackoxideremoval)
d-8铣靶(spotface)
d-9去溢胶(resinflushremoval)
e.减铜(copperreduction)
e-1薄化铜(copperreduction)
f.电镀(horizontalelectrolyticplating)
f-1水平电镀(horizontalelectro-plating)(panelplating)
f-2锡铅电镀(tin-leadplating)(patternplating)
f-3低于1mil(lessthan1milthickness)
f-4高于1mil(morethan1milthickness)
f-5砂带研磨(beltsanding)
f-6剥锡铅(tin-leadstripping)
f-7微切片(microsection)
g.塞孔(plughole)
g-1印刷(inkprint)
g-2预烤(precure)
g-3表面刷磨(scrub)
g-4后烘烤(postcure)
h.防焊(绿漆/绿油):(soldermask)
h-1c面印刷(printingtopside)
h-2s面印刷(printingbottomside)
h-3静电喷涂(spraycoating)
h-4前处理(pretreatment)
h-5预烤(precure)
h-6曝光(exposure)
h-7显影(develop)
h-8后烘烤(postcure)
h-9uv烘烤(uvcure)
h-10文字印刷(printingoflegend)
h-11喷砂(pumice)(wetblasting)
h-12印可剥离防焊(peelablesoldermask)
i.镀金goldplating
i-1金手指镀镍金(goldfinger)
i-2电镀软金(softni/auplating)
i-3浸镍金(immersionni/au)(electrolessni/au)
j.喷锡(hotairsolderleveling)
j-1水平喷锡(horizontalhotairsolderleveling)
j-2垂直喷锡(verticalhotairsolderleveling)
j-3超级焊锡(supersolder)
j-4.印焊锡突点(solderbump)
k.成型(profile)(form)
k-1捞型(n/crouting)(milling)
k-2模具冲(punch)
k-3板面清洗烘烤(cleaning&backing)
k-4v型槽(v-cut)(v-scoring)
k-5金手指斜边(bevelingofg/f)
l.开短路测试(electricaltesting)(continuity&insulationtesting)
l-1aoi光学检查(aoiinspection)
l-2vrs目检(verified&repaired)
l-3泛用型治具测试(universaltester)
l-4专用治具测试(dedicatedtester)
l-5飞针测试(flyingprobe)
m.终检(finalvisualinspection)
m-1压板翘(warpageremove)
m-2x-out印刷(x-out
