PCB专业用语

一、综合词汇

1、印制电路:printedcircuit

2、印制线路:printedwiring

3、印制板:printedboard

4、印制板电路:printedcircuitboard(pcb)

5、印制线路板:printedwiringboard(pwb)

6、印制元件:printedcomponent

7、印制接点:printedcontact

8、印制板装配:printedboardassembly

9、板:board

10、单面印制板:single-sidedprintedboard(ssb)

11、双面印制板:double-sidedprintedboard(dsb)

12、多层印制板:mulitlayerprintedboard(mlb)

13、多层印制电路板:mulitlayerprintedcircuitboard

14、多层印制线路板:mulitlayerpritedwiringboard

15、刚性印制板:rigidprintedboard

16、刚性单面印制板:rigidsingle-sidedprintedborad

17、刚性双面印制板:rigiddouble-sidedprintedborad

18、刚性多层印制板:rigidmultilayerprintedboard

19、挠性多层印制板:flexiblemultilayerprintedboard

20、挠性印制板:flexibleprintedboard

21、挠性单面印制板:flexiblesingle-sidedprintedboard

22、挠性双面印制板:flexibledouble-sidedprintedboard

23、挠性印制电路:flexibleprintedcircuit(fpc)

24、挠性印制线路:flexibleprintedwiring

25、刚性印制板:flex-rigidprintedboard,rigid-flexprintedboard

26、刚性双面印制板:flex-rigiddouble-sidedprintedboard,rigid-flexdouble-sidedprinted

27、刚性多层印制板:flex-rigidmultilayerprintedboard,rigid-flexmultilayerprintedboard

28、齐平印制板:flushprintedboard

29、金属芯印制板:metalcoreprintedboard

30、金属基印制板:metalbaseprintedboard

31、多重布线印制板:mulit-wiringprintedboard

32、陶瓷印制板:ceramicsubstrateprintedboard

33、导电胶印制板:electroconductivepasteprintedboard

34、模塑电路板:moldedcircuitboard

35、模压印制板:stampedprintedwiringboard

36、顺序层压多层印制板:sequentially-laminatedmulitlayer

37、散线印制板:discretewiringboard

38、微线印制板:microwireboard

39、积层印制板:buile-upprintedboard

40、积层多层印制板:build-upmulitlayerprintedboard(bum)

41、积层挠印制板:build-upflexibleprintedboard

42、表面层合电路板:surfacelaminarcircuit(slc)

43、埋入凸块连印制板:b2itprintedboard

44、多层膜基板:multi-layeredfilmsubstrate(mfs)

45、层间全内导通多层印制板:alivhmultilayerprintedboard

46、载芯片板:chiponboard(cob)

47、埋电阻板:buriedresistanceboard

48、母板:motherboard

49、子板:daughterboard

50、背板:backplane

51、裸板:bareboard

52、键盘板夹心板:copper-invar-copperboard

53、动态挠性板:dynamicflexboard

54、静态挠性板:staticflexboard

55、可断拼板:break-awayplanel

56、电缆:cable

57、挠性扁平电缆:flexibleflatcable(ffc)

58、薄膜开关:membraneswitch

59、混合电路:hybridcircuit

60、厚膜:thickfilm

61、厚膜电路:thickfilmcircuit

62、薄膜:thinfilm

63、薄膜混合电路:thinfilmhybridcircuit

64、互连:interconnection

65、导线:conductortraceline

66、齐平导线:flushconductor

67、传输线:transmissionline

68、跨交:crossover

69、板边插头:edge-boardcontact

70、增强板:stiffener

71、基底:substrate

72、基板面:realestate

73、导线面:conductorside

74、元件面:componentside

75、焊接面:solderside

76、印制:printing

77、网格:grid

78、图形:pattern

79、导电图形:conductivepattern

80、非导电图形:non-conductivepattern

81、字符:legend

82、标志:mark

二、基材:

1、基材:basematerial

2、层压板:laminate

3、覆金属箔基材:metal-cladbadematerial

4、覆铜箔层压板:copper-cladlaminate(ccl)

5、单面覆铜箔层压板:single-sidedcopper-cladlaminate

6、双面覆铜箔层压板:double-sidedcopper-cladlaminate

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发布日期:2019年07月02日  所属分类:参考设计