线路板(PCB)流程术语中英文对照

线路板(PCB)流程术语中英文对照


流程简介:开料--钻孔--干膜制程--压合--减铜--电镀--塞孔--防焊(绿漆/绿油)


          --镀金--喷锡--成型--开短路测试--终检--雷射钻孔


A. 开料( Cut LaminaTIon)


a-1 裁板( Sheets CutTIng)


a-2 原物料发料(Panel)(Shear material to Size)


B. 钻孔(Drilling)


b-1 内钻(Inner Layer Drilling )


b-2 一次孔(Outer Layer Drilling )


b-3 二次孔(2nd Drilling)


b-4 雷射钻孔(Laser Drilling )(Laser AblaTIon )


b-5 盲(埋)孔钻孔(Blind & Buried Hole Drilling)


C. 干膜制程( Photo Process(D/F))


c-1 前处理(Pretreatment)


c-2 压膜(Dry Film LaminaTIon)


c-3 曝光(Exposure)


c-4 显影(Developing)


c-5 蚀铜(Etching)


c-6 去膜(Stripping)


c-7 初检( Touch-up)


c-8 化学前处理,化学研磨( Chemical Milling )


c-9 选择性浸金压膜(Selective Gold Dry Film Lamination)


c-10 显影(Developing )


c-11 去膜(Stripping )


Developing , Etching & Stripping ( DES )


D. 压合Lamination


d-1 黑化(Black Oxide Treatment)


d-2 微蚀(Microetching)


d-3 铆钉组合(eyelet )


d-4 叠板(Lay up)


d-5 压合(Lamination)


d-6 后处理(Post Treatment)


d-7 黑氧化( Black Oxide Removal )


d-8 铣靶(spot face)


d-9 去溢胶(resin flush removal)


E. 减铜(Copper Reduction)


e-1 薄化铜(Copper Reduction)


F. 电镀(Horizontal Electrolytic Plating)


f-1 水平电镀(Horizontal Electro-Plating) (Panel Plating)


f-2 锡铅电镀( Tin-Lead Plating ) (Pattern Plating)


f-3 低于1 mil ( Less than 1 mil Thickness )


f-4 高于1 mil ( More than 1 mil Thickness)


f-5 砂带研磨(Belt Sanding)


f-6 剥锡铅( Tin-Lead Stripping)


f-7 微切片( Microsection)


G. 塞孔(Plug Hole)


g-1 印刷( Ink Print )


g-2 预烤(Precure)


g-3 表面刷磨(Scrub)


g-4 后烘烤(Postcure)


H. 防焊(绿漆/绿油): (Solder Mask)


h-1 C面印刷(Printing Top Side)


h-2 S面印刷(Printing Bottom Side)


h-3 静电喷涂(Spray Coating)


h-4 前处理(Pretreatment)


h-5 预烤(Precure)


h-6 曝光(Exposure)


h-7 显影(Develop)


h-8 后烘烤(Postcure)


h-9 UV烘烤(UV Cure)


h-10 文字印刷( Printing of Legend )


h-11 喷砂( Pumice)(Wet Blasting)


h-12 印可剥离防焊(Peelable Solder Mask)


I . 镀金Gold plating


i-1 金手指镀镍金( Gold Finger )


i-2 电镀软金(Soft Ni/Au Plating)


i-3 浸镍金( Immersion Ni/Au) (Electroless Ni/Au)


J. 喷锡(Hot Air Solder Leveling)


j-1 水平喷锡(Horizontal Hot Air Solder Leveling)


j-2 垂直喷锡( Vertical Hot Air Solder Leveling)


j-3 超级焊锡(Super Solder )


j-4. 印焊锡突点(Solder Bump)


K. 成型(Profile)(Form)


k-1 捞型(N/C Routing ) (Milling)


k-2 模具冲(Punch)


k-3 板面清洗烘烤(Cleaning & Backing)


k-4 V型槽( V-Cut)(V-Scoring)


k-5 金手指斜边( Beveling of G/F)


L. 开短路测试(Electrical Testing) (Continuity & Insulation Testing)


l-1 AOI 光学检查( AOI Inspection)


l-2 VRS 目检(Verified & Repaired)


l-3 泛用型治具测试(Universal Tester)


l-4 专用治具测试(Dedicated Tester)


l-5 飞针测试(Flying Probe)


M. 终检( Final Visual Inspection)


m-1 压板翘( Warpage Remove)


m-2 X-OUT 印刷(X-Out Marking)


m-3 包装及出货(Packing & shipping)


m-4 目检( Visual Inspection)


m-5 清洗及烘烤( Final Clean & Baking)


m-6 护铜剂(ENTEK Cu-106A)(OSP)


m-7 离子残余量测试(Ionic Contamination Test )(Cleanliness Test)


m-8 冷热冲击试验(Thermal cycling Testing)


m-9 焊锡性试验( Solderability Testing )


N. 雷射钻孔(Laser Ablation)


N-1 雷射钻Tooling孔(Laser ablation Tooling Hole)


N-2 雷射曝光对位孔(Laser Ablation Registration Hole)


N-3 雷射Mask制作(Laser Mask)


N-4 雷射钻孔(Laser Ablation)


N-5 AOI 检查及VRS ( AOI Inspection & Verified & Repaired)


N-6 Blaser AOI (after Desmear and Microetching)


N-7 除胶渣(Desmear)


N-8 微蚀(Microetching )


 

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发布日期:2019年07月13日  所属分类:电子百科