(TOSHIBA)东芝光耦:DIP4(LF2)封装


SpecificaTIon of DIP4(LF2) package Toshiba Code

11-5B202

MounTIng

Through Hole

Pins

4

Weight (typ.)

0.26 g

Packing Method

Magazine

Minimum QuanTIty

100 pcs/Magazine

Package Dimensions (mm)

(TOSHIBA)东芝光耦:DIP4(LF2)封装

MagazineDimensions (mm)

(TOSHIBA)东芝光耦:DIP4(LF2)封装
Thickness: 0.5 mm

(TOSHIBA)东芝光耦:DIP4(LF2)封装
A: Magazine, B: Stopper

For TLP781 and TLP781F, please refer individual Datasheet.

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发布日期:2019年07月14日  所属分类:电子百科