采用DIP16(LF1)封装的光耦

采用DIP16(LF1)封装的光耦SpecificaTIon of DIP16(LF1) package

Toshiba Code

11-20A301

MounTIng

Surface Mount

Pins

16

Weight (typ.)

1.1 g

Packing Method

Magazine

Minimum QuanTIty

25 pcs/Magazine

Package Dimensions (mm)
/
Land Pattern Example (mm)

MagazineDimensions (mm)

Thickness: 0.5 mm

A: Magazine, B: Stopper