常用集成电路的封装形式
常用集成电路的封装形式
CLCC
DIP
Dual Inline Package
DIP-tab
Dual Inline Package with Metal Heatsink
FBGA
FDIP
FTO220
Flat Pack
HSOP28
ITO220
ITO3p
JLCC
LCC
LDCC
LGA
LQFP
PCDIP
PLCC
PQFP
PSDIP
LQFP 100L
METAL QUAD 100L
PQFP 100L
QFP
Quad Flat Package
SOT143
SOT220
SOT223
SOT223
SOT23
SOT23/SOT323
SOT25/SOT353
SOT26/SOT363
SOT343
SOT523
SOT89
SOT89
LAMINATE TCSP 20L
Chip Scale Package
TO252
TO263/TO268
SO DIMM
Small Outline Dual In-line Memory Module
QFP
Quad Flat Package
TQFP 100L
SBGA
SC-70 5L
SDIP
SIP
Single Inline Package
SO
Small Outline Package
SOJ 32L
SOJ
SOP EIAJ TYPE II 14L
SOT220
SSOP 16L
SSOP
TO18
TO220
TO247
TO264
TO3
TO5
TO52
TO71
TO72
TO78
TO8
TO92
TO93
TO99
TSOP
Thin Small Outline Package
TSSOP or TSOP II
Thin Shrink Outline Package
uBGA
Micro Ball Grid Array
ZIP
Zig-Zag Inline Package
BQFP132
TEPBGA 288L
TEPBGA 288L
C-Bend Lead
CERQUAD
Ceramic Quad Flat Pack
Ceramic Case
Gull Wing Leads
J-STD
J-STD
Joint IPC / JEDEC Standards
JEP
JEP
JEDEC PublicaTIons
JESD
JESD
JEDEC Standards
LLP 8La
PCMCIA
PDIP
PLCC
PS/2
PS/2
mouse port pinout
SIMM30
SIMM30
Pinout
SIMM72
SIMM72
Pinout
SNAPTK
SNAPTK
SNAPZP
SOH
