KEY FEATURES
? Etching, Ashing, De-oxidation System
? Multi-generator for High Density Plasma
SPECIFICATIONS
? High Density Plasma Etching Mode
? 4", 6", 8" Substrate Loading
? Single or Multi LF/RF Generator
? Up to 8 Process Gas Channels
? Integration with Ultrasonic Source
APPLICATIONS
? De-oxidation for Electronic Packaging Industry
? Plasma Annealing for Metal Science
