YCR单向可控硅系列
◆先进的玻璃钝化芯片 ◆小的通态压降 ◆高的可靠性、稳定性
◆先进的玻璃钝化芯片 ◆小的通态压降 ◆高的可靠性、稳定性
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型号
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符号
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芯片尺寸
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IT（RMS）
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VDRM
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VRRM
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IGT
|
VTM
|
VGT
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IH
|
IISM
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dt/dt
|
封装外型
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|||
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微触发系列
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单位
|
mm2
|
A
|
V
|
V
|
mA
|
V
|
V
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mA
|
A
|
V/us
|
||
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YCR006
|
0.8x0.8
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0.6
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≥400
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≥400
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≤0.2
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≤1.7
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≤0.8
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≤40
|
≥6
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≥10
|
TO-92
|
||
|
YCR008
|
0.9x0.9
|
0.8
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≥400
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≥400
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≤0.2
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≤1.7
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≤0.8
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≤40
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≥8
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≥10
|
TO-92
|
||
|
YCR01
|
0.94x0.94
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1.0
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≥400
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≥400
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≤0.2
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≤1.7
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≤0.8
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≤40
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≥10
|
≥10
|
TO-92
|
||
|
YCR015
|
1.3x1.3
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1.5
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≥400
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≥400
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≤0.2
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≤1.7
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≤0.8
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≤40
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≥15
|
≥10
|
TO-92
|
||
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YCR02
|
1.5x1.5
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2.0
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≥400
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≥400
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≤0.2
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≤1.7
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≤0.8
|
≤40
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≥20
|
≥10
|
TO-92L、TO-202、TO=220
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||
|
YCR05
|
2.1x2.1
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5.0
|
≥400
|
≥400
|
≤0.2
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≤1.7
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≤0.8
|
≤40
|
≥50
|
≥10
|
TO-126、TO-202、TO-220
|
||
|
强触发系列
|
YCR05M
|
2.1x2.1
|
5.0
|
≥400
|
≥400
|
≤25
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≤1.7
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≤1.5
|
≤20
|
≥50
|
≥200
|
TO-220、TO-251、TO-252
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|
|
YCR08
|
2.5x2.5
|
8.0
|
≥400
|
≥400
|
≤25
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≤1.7
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≤1.5
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≤20
|
≥80
|
≥200
|
TO-220
|
||
|
YCR12
|
2.9x2.9
|
12
|
≥400
|
≥400
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≤25
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≤1.7
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≤1.5
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≤20
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≥120
|
≥200
|
TO-220
|
||
|
YCR20
|
3.5x3.5
|
20
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≥400
|
≥400
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≤25
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≤1.7
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≤1.5
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≤20
|
≥200
|
≥200
|
TO-220
|
||
|
型号
|
YTR双向可控硅系列
◆先进的玻璃钝化芯片 ◆小的通态压降 ◆高的可靠性、稳定性 |
||||||||||||
|
符号
|
|||||||||||||
|
芯片尺寸
|
IT（RMS）
|
VDRM
|
VRRM
|
IGT
|
VTM
|
VGT
|
ITSM
|
dt/dt（C）
|
外型
|
国外对应型号
|
|||
|
单位
|
mm2
|
A
|
V
|
V
|
mA
|
V
|
V
|
A
|
V/us
|
||||
|
YTR01
|
1.3X1.3
|
1
|
≥400
|
≥400
|
≤10
|
≤10
|
≤10
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≤1.7
|
≤2.2
|
≥10
|
≥5
|
TO-92
|
MACC97A系列
|
|
YTR02
|
1.8X1.8
|
2
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≥400
|
≥400
|
≤20
|
≤20
|
≤20
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≤1.7
|
≤2.2
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≥20
|
≥5
|
TO-92L、TO-126、TO-220
|
|
|
YTR04
|
2.5X2.5
|
4
|
≥400
|
≥400
|
≤30
|
≤30
|
≤30
|
≤1.7
|
≤2.2
|
≥40
|
≥5
|
||
|
TO-220、TO-252
|
BT136
|
||||||||||||
|
YTR06
|
2.9X2.9
|
6
|
≥400
|
≥400
|
≤30
|
≤30
|
≤30
|
≤1.7
|
≤2.2
|
≥60
|
≥5
|
TO-220
|
|
|
YTR08
|
3.2X3.2
|
8
|
≥400
|
≥400
|
≤30
|
≤30
|
≤30
|
≤1.7
|
≤2.2
|
≥80
|
≥5
|
TO-220
|
|
|
YTR10
|
3.5X3.5
|
10
|
≥400
|
≥400
|
≤30
|
≤30
|
≤30
|
≤1.7
|
≤2.2
|
≥100
|
≥5
|
TO-220
|
|
